Stackable multi-chip package system with support structure

Details Stackable multi-chip package system with support structure Stackable multi-chip package system with support structure

2011-03-29

2011-03-29

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S787000, C257SE23043, C257SE23085

Reexamination Certificate

active

07915738

ABSTRACT:
A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.

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