Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-01-10
2006-01-10
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S686000, C257S777000, C257S772000
Reexamination Certificate
active
06984881
ABSTRACT:
Improved apparatus and methods for stacking integrated circuit packages having leads are disclosed. According to one embodiment, the leads of an integrated circuit package are exposed and provided with solder balls so that corresponding leads of another integrated circuit package being stacked thereon can be electrically connected. The stacking results in increased integrated circuit density with respect to a substrate, yet the stacked integrated circuit packages are able to still enjoy having an overall thin or low profile.
REFERENCES:
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5221858 (1993-06-01), Higgins, III
patent: 5291061 (1994-03-01), Ball
patent: 5331235 (1994-07-01), Chun
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5596225 (1997-01-01), Mathew et al.
patent: 5617297 (1997-04-01), Lo et al.
patent: 5625221 (1997-04-01), Kim et al.
patent: 5629563 (1997-05-01), Takiar et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 5804880 (1998-09-01), Mathew
patent: 5986209 (1999-11-01), Tandy
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6080264 (2000-06-01), Ball
patent: 6137163 (2000-10-01), Kim et al.
patent: 6301121 (2001-10-01), Lin
patent: 6303997 (2001-10-01), Lee
patent: 6323060 (2001-11-01), Isaak
patent: 6378758 (2002-04-01), Haba
patent: 6437433 (2002-08-01), Ross
patent: 6455928 (2002-09-01), Corisis et al.
patent: 6458617 (2002-10-01), Liao et al.
patent: 6476475 (2002-11-01), Lee
patent: 6482677 (2002-11-01), Sato et al.
patent: 6577012 (2003-06-01), Greenwood et al.
patent: 6674173 (2004-01-01), Wang
patent: 6677181 (2004-01-01), Park et al.
patent: 2001/0013645 (2001-08-01), King et al.
patent: 2002/0149091 (2002-10-01), Palmteer et al.
patent: 2002/0158325 (2002-10-01), Yano et al.
patent: 2003/0011068 (2003-01-01), Song et al.
patent: 2003/0197260 (2003-10-01), Nishimura et al.
patent: 4-321261 (1992-11-01), None
Eric Bogatin,Roadmaps of Packaging Technology, published by Integrated Circuit Engineering Corporation, 1997, Chapter 13, “Next Generation Technologies,” pp. 13-1 thru 13-34.
Al-sarawi et al., “A Review of 3-D Packaging Technology,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol. 21, No. 1, Feb. 1998, pp. 2-14.
“MicroLeadFrame Package,” data sheet, Amkor Technology, Inc., 2 pages.
Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame(MLF)Packages, Amkor Technology, Inc., Rev. C, Sep. 2002, pp. 1-18.
“Flip Chip MicroLeadFrames (fcMLF) Package,” data sheet, Amkor Technology, Inc., 2 pages.
“RF Wireless,” fact sheet, Amkor Technology, Inc., 1 page.
“Amkor Expanding MicroLeadFrame Capacity to Meet Market Demand,” press release, Amkor Technology, Inc., Sep. 23, 2002, 2 pages.
“Amkor Starts Producing Saw-Singulated QFN Packages,” press release, Amkor Technology, Inc., Nov. 12, 2001, 2 pages.
“MicroLeadFrame (MLF),” product data sheet, Amkor Technology, Inc., 3 pages, downloaded from http://www.amkor.com/products/All_Products.MLF.cfm on Dec. 3, 2002.
“MLF Packaging Process,” informational slides, Amkor Technology, Inc., 4 sheets.
“Automotive/Thermal Enhanced Power Products,” informational slides, Amkor Technology, Inc., 2000, 16 sheets.
Hara, “Sharp package stacks chips in system integration play,” EE Times, Jul. 30, 1999, 4 pages.
Sharp IC Packaging Services by Sharp Foundry, product information data sheet, Sharp Microelectronics of the Americas, downloaded from http://www.sharpsma.com/foundry/ic-packaging.htm on Feb. 5, 2003.
Sharp SMA Stacked CSP, website product information sheet (downloaded Dec. 6, 2002 from http://www.sharpsma.com/sma/products/memory/Packages/Stacked_CSP.htm) pp. 1-2.
Sharp Combination Memories (Stacked CSP), website product datasheet (downloaded Dec. 17, 2002 from http://sharp-world.com/products/device/flash/cmlist.html), pp. 1-3.
Kada et al., “Advancements in Stacked Chip Scale Packaging (S-CSP), Provides System-in-a-Package Functionality for Wireless and Handheld Applications,” Proceedings of Pan Pacific Microelectronics Symposium Conference, Jan. 2000, pp. 1-7.
Sharp SMA Flash Memories CSP, website product information sheet (downloaded Dec. 6, 2002 from http://www.sharpsma.com/sma/products/memory/Packages/CSP.htm.), pp. 1-2.
John H. Day, “Packaging Options Stack Up for Stacking Active Devices,” EE Times, Oct. 4, 2001, pp. 1-4.
LRS13023: Stacked Chip 8M Flash and 1M SRAM, Sharp Integrated Circuits Group, product specification, Spec. No. EL116039, Jun. 11, 1999, pp. 1-60.
International Search Report dated may 25, 2005 re International Application No. PCT/US2004/018020.
Written Opinion of the International Searching Authority dated May 24, 2005 re International Application No. PCT/US2004/018020.
Beyer Weaver & Thomas LLP
Clark Jasmine
SanDisk Corporation
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