Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2009-09-25
2011-10-25
Wagner, Jenny L. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S686000, C257SE23114
Reexamination Certificate
active
08044494
ABSTRACT:
A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.
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Mangrum Marc A.
Mistry Addi B.
Patten David T.
Phou Jesse
Tran Ziep
Chiu Joanna G.
Freescale Semiconductor Inc.
Singh Ranjeev
Wagner Jenny L.
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