Stackable heatsink structures for semiconductor devices

Details Stackable heatsink structures for semiconductor devices Stackable heatsink structures for semiconductor devices

1997-03-19

1999-05-04

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257722, 361703, 361717, 165 803, H01L 2334

Patent

active

059006706

ABSTRACT:
A stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess opening are sized and shaped such that an interference fit is formed when the button-like projection of one fin layer is pressed into the recess of another fin layer. The use of an adaptor to increase or decrease the effective size of the button-like projection of the bottommost fin layer is described. Relieving gases that may be entrapped in the recess during assembly is described. Circular, elliptical and polygonal shapes (outlines) for the fin layers are described.

REFERENCES:
patent: 2414801 (1947-01-01), Clarke
patent: 3205936 (1965-09-01), Katz
patent: 3372733 (1968-03-01), Callender
patent: 3388739 (1968-06-01), Olson et al.
patent: 3413532 (1968-11-01), Boyer
patent: 3457988 (1969-07-01), Meyerhoff et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4158719 (1979-06-01), Franz
patent: 4340902 (1982-07-01), Honda et al.
patent: 4345267 (1982-08-01), Corman et al.
patent: 4396935 (1983-08-01), Schuck
patent: 4404582 (1983-09-01), Pollard et al.
patent: 4535384 (1985-08-01), Wakabayashi
patent: 4620215 (1986-10-01), Lee
patent: 4733293 (1988-03-01), Gabuzda
patent: 4785075 (1988-11-01), Shimp
patent: 4788627 (1988-11-01), Ehlert et al.
patent: 4810289 (1989-03-01), Hoyer et al.
patent: 4839422 (1989-06-01), Craig, Jr.
patent: 4849856 (1989-07-01), Funari et al.
patent: 4909841 (1990-03-01), Iyer et al.
patent: 4954170 (1990-09-01), Fey et al.
patent: 5057903 (1991-10-01), Olla
patent: 5150195 (1992-09-01), Nguyen
patent: 5155066 (1992-10-01), Nguyen
patent: 5172301 (1992-12-01), Schneider
patent: 5175612 (1992-12-01), Long et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5293930 (1994-03-01), Pitasi
patent: 5310520 (1994-05-01), Jha et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5514327 (1996-05-01), Schneider
patent: 5654587 (1997-08-01), Schneider et al.
patent: 5693981 (1997-12-01), Schneider et al.
St. Marys Carbon Company document entitled "Powder Metallurgy Division".
Sue Oliver, LSI Logic Corporation; My Hguyen and Michael Grosse, Johnson Matthey Electronics, "Siler/Poolymer Die Attach for Ceramic Package Assembly,".

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