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Complexes with tridentate ligands

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material
Reexamination Certificate

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Compliant bonding structures for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Compliant component for supporting electrical interface...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Reexamination Certificate

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Compliant contact system with alignment structure for testing un

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Compliant integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Compliant integrated circuit package and method of fabricating t

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Compliant integrated circuit package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Compliant interconnects for semiconductors and micromachines

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Compliant interconnects for semiconductors and micromachines

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Compliant interface for semiconductor chip and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Compliant lead structures for microelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Compliant microelectronic assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Compliant multi-composition interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Compliant multichip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Compliant multichip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Compliant package with conductive elastomeric posts

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Compliant relief wafer level packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Compliant semiconductor chip assemblies and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Compliant semiconductor chip package with fan-out leads and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Compliant semiconductor package with anisotropic conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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