Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-12-06
2005-12-06
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S787000, C257S795000, C257S791000
Reexamination Certificate
active
06972495
ABSTRACT:
An assembly including a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
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Clark Jasmine
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
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