Compliant interconnects for semiconductors and micromachines

Details Compliant interconnects for semiconductors and micromachines Compliant interconnects for semiconductors and micromachines

2008-05-27

2008-05-27

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE23078

Reexamination Certificate

active

07378742

ABSTRACT:
A compliant interconnect is described that is useful for coupling semiconductor dies to other components. In one embodiment, the interconnect includes a base to couple to a first component and an arch extending from and integral with the base to couple to a second component. The interconnect may be formed by coating a substrate with photoresist, exposing the photoresist with a defined pattern, developing the photoresist, baking the photoresist at a first temperature for a first amount of time to reflow the photoresist, and baking the photoresist at a second higher temperature for a second amount of time to reflow the photoresist.

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Zhu et al., “Development of G-Helix Structure as Off-Chip Interconnect”, Journal of Electronic Packaging, Jun. 2004, vol. 126, pp. 237-246.

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