Compliant integrated circuit package substrate

Details Compliant integrated circuit package substrate Compliant integrated circuit package substrate

2010-02-05

2010-06-29

Kebede, Brook (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S686000, C257SE23038

Reexamination Certificate

active

07745917

ABSTRACT:
An integrated circuit package may include a plurality of interconnects, and an integrated package substrate coupled to the plurality of interconnects and comprising an integrated circuit package substrate core. A first surface of the integrated circuit package substrate core may define a depression.

REFERENCES:
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5956235 (1999-09-01), Kresge et al.
patent: 2002/0027441 (2002-03-01), Akram et al.
patent: 2003/0008182 (2003-01-01), Saitoh et al.
patent: 2004/0217470 (2004-11-01), Takano

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