Compliant integrated circuit package and method of fabricating t

Details Compliant integrated circuit package and method of fabricating t Compliant integrated circuit package and method of fabricating t

1994-12-29

1999-07-27

Vo, Peter

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

29841, 174 523, 257684, 257687, 26427217, H01L 2304, H05K 1304

Patent

active

059295171

ABSTRACT:
Semiconductor chip packages and methods of fabricating the same. The package includes a thermally conductive protective structure having an indentation open to a front side and a flange surface at least partially surrounding the indentation and facing to the front of the structure. A chip is disposed in the indentation so that the front surface of the chip, with contacts thereon, faces toward the front of the structure. A flexible dielectric film having terminals thereon is placed on the flange surface, and a compliant material is disposed between the film and the flange surface. The terminals on the film are connected to the contacts on the chip. The individual terminals on the film are movable with respect to the protective structure, which facilitates mounting and compensation for thermal expansion.

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