LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Wafer packaging and singulation method

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects

Wafer pattern variation of integrated circuit fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Wafer scale burn-in socket

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Wafer scale die handling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Wafer scale fiber optic termination

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Wafer scale integrated circuit and method of forming signal prop

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Wafer scale of full wafer memory system, packaging method thereo

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Wafer scale optoelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Wafer scale or full wafer memory system, packaging method thereo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Wafer scale package and method of assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Wafer scale packaging scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Wafer scale processing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Wafer scale semiconductor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Wafer scale thin film package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Wafer sheet with adhesive on both sides and attached...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Wafer stacked package having vertical heat emission path and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Wafer stacked package waving bertical heat emission path and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Wafer stacking using interconnect structures of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Wafer stacking with anisotropic conductive adhesive