LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reliable metal bumps on top of I/O pads with test probe marks

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reliable metal leads in high speed LSI semiconductors using dumm

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reliable metallization with barrier for semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reliable printed wiring board assembly employing packages...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reliable printed wiring board assembly employing packages...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reliable semiconductor device and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reliable via structures having hydrophobic inner wall surfaces

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Remanent memory device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Remote chip attachment

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Remote indium bump corrugated PV diodes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Remote thermal vias for densely packed electrical assemblage

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Removable heat transfer apparatus for a pin grid array (PGA)...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Removable VLSI assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Removal of extended bond pads using intermetallics

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Removal of heat from SOI device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Removal of metal cusp for improved contact fill

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Repair line structure for thin film electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Repairable flip-chip undercoating assembly and method and materi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Repairable multi-chip package