Removable VLSI assembly

Details Removable VLSI assembly Removable VLSI assembly

1991-09-24

1992-11-17

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

361400, 257697, 257772, H01L 2302

Patent

active

051648180

ABSTRACT:
A system for mounting VLSI devices on a substrate is disclosed, offering a high contact density. Each package consists of a semiconductor device having protruding elongated contact pin (2) on its surface and a wiring substrate having a cavity (3) on its surface. The cavities are filed with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins are made to penetrate the foil, and extend into the conductive alloy, thus making electrical contact therewith. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.

REFERENCES:
patent: 2958064 (1960-10-01), Swengel
patent: 4885126 (1989-12-01), Polonio
patent: 5036163 (1991-07-01), Spielberger

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