Reliable printed wiring board assembly employing packages...

Details Reliable printed wiring board assembly employing packages... Reliable printed wiring board assembly employing packages...

2008-01-08

2008-01-08

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S701000, C257S702000, C257SE23145

Reexamination Certificate

active

07317255

ABSTRACT:
An exemplary assembly comprises a printed wiring board having a first surface, and a package including a plurality of solder joints, such as solder balls, on one surface of the package. An anchor via is defined through the first surface of the printed wiring board, and conductive material situated in the anchor via is connected to or integral with a respective solder joint of the package.

REFERENCES:
patent: 6222277 (2001-04-01), Downes
patent: 6252779 (2001-06-01), Pierson et al.
patent: 6353189 (2002-03-01), Shimada et al.
patent: 6392898 (2002-05-01), Asai et al.
patent: 6803664 (2004-10-01), Murayama
patent: 7030480 (2006-04-01), Kimura et al.
patent: 2003/0183421 (2003-10-01), Dishongh et al.
patent: 2004/0064942 (2004-04-01), Chung et al.
patent: 2004/0118606 (2004-06-01), McCormick et al.

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