Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1995-11-06
1998-07-21
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257782, H01L 2348, H01L 2352, H01L 2740
Patent
active
057838674
ABSTRACT:
In a method for reversible assembly of a semiconductor electronic flip-chip device to an electrical interconnecting substrate, a filled thermoplastic adhesive is interposed between an active face of the flip-chip device and a bond site on the substrate. Electrical connection is established between the flip-chip device and the substrate and, generally simultaneously, adhesive bonding between them is established via viscous flow of the filled thermoplastic adhesive above its glass transition temperature, followed by cooling of the adhesive. The adhesive can be reheated to free the flip-chip device of its adhesive bond to the substrate. The filled thermoplastic adhesive includes a low expansion filler in a binder matrix. In accordance with one aspect of the invention, the binder matrix is poly(aryl ether ketone) having the chemical formula ##STR1## where n is from 5 to 150 and R is selected from suitable divalent moieties. The filled thermoplastic adhesive can be interposed between the flip-chip device and the substrate as a preform or by other suitable method, such as syringe extrusion in a molten or viscous state.
REFERENCES:
patent: 4999699 (1991-03-01), Christie et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5162613 (1992-11-01), Schoenthaler
patent: 5258648 (1993-11-01), Lin
patent: 5347162 (1994-09-01), Pasch
patent: 5436503 (1995-07-01), Kunitomo et al.
patent: 5550408 (1996-08-01), Kunitomo et al.
patent: 5641996 (1997-06-01), Omoya et al.
Electronic Packaging and Production, 31:43 "Encapsulated Flip Chips More Reliable" (1991).
International Search Report, Feb. 18, 1997.
Poly(aryl Ethers) by Nucleophilic Aromatic Substitution. I. Synthesis and Properties, Johnson, et al.; Journal Of Polymer Science:Part A-1, vol. 5, 2375-2398 (1967).
Aromatic Polyethers of the "Cardic" Type, Vinogradova, S.V. et al; Polymer Science U.S.S.R., 2962-2970, (1971).
Negative Thermal Expansion Ceramics: A Review, Chu, et al.; Materials Science and Engineering, 95 (1987) 303-308.
Belke Robert Edward
Hayden Brian J.
Todd Michael G.
Walles Bethany
Clark S. V.
Ford Motor Company
May Roger L.
Melotik Lorraine S.
Saadat Mahshid D.
LandOfFree
Repairable flip-chip undercoating assembly and method and materi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Repairable flip-chip undercoating assembly and method and materi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Repairable flip-chip undercoating assembly and method and materi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1649239