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Multiple chip semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Multiple chip stack structure and cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Multiple chips bonded to packaging structure with low noise...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Multiple chips bonded to packaging structure with low noise...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Multiple chips bonded to packaging structure with low noise...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Multiple chips image sensor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Multiple chips image sensor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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Multiple color detection elevated pin photo diode active pixel s

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Multiple component solid state white light

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices
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Multiple conductive plug structure for lateral RF MOS devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Multiple conductive plug structure including at least one...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Multiple copper vias for integrated circuit metallization

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Multiple copper vias for integrated circuit metallization...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Multiple data state memory cell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Multiple data state memory cell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Multiple dice package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Multiple die integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Multiple die lead frame package with enhanced die-to-die...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Multiple die stack apparatus employing T-shaped interposer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Multiple die stack apparatus employing T-shaped interposer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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