Multiple dice package

Details Multiple dice package Multiple dice package

2005-06-14

2005-06-14

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S701000

Reexamination Certificate

active

06906406

ABSTRACT:
A semiconductor device for multiple dice is provided that reduces insertion loss and return loss. In an example embodiment, the semiconductor device comprises: a package20comprising a mount surface14to which dice61and65are mounted, and a bond pad surface25defining at least a first die area27and a second die area29,wherein the second die area29is different in form from the first die area27.

REFERENCES:
patent: 5138436 (1992-08-01), Koepf
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5701233 (1997-12-01), Carson et al.

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