Multiple chip semiconductor packages

Details Multiple chip semiconductor packages Multiple chip semiconductor packages

2006-04-04

2006-04-04

Loke, Steven (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S686000, C257S693000, C257S675000, C257S706000, C257S666000, C257S690000, C257S697000

Reexamination Certificate

active

07023076

ABSTRACT:
A semiconductor package, containing two or more IC devices. The IC devices are oriented in the same manner and at least two IC devices are separated by a die paddle that is attached to the active face of one of the IC devices, inward of the electrical contact areas.

REFERENCES:
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5793108 (1998-08-01), Nakanishi et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6559526 (2003-05-01), Lee et al.
patent: 6603072 (2003-08-01), Foster et al.
patent: 6650009 (2003-11-01), Her et al.
patent: 2002/0090753 (2002-07-01), Pai et al.
patent: 2003/0127719 (2003-07-01), Chang

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