Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2003-05-13
2008-12-23
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE25013, C257SE25011, C257SE25030, C257S685000, C257SE23079, C257S777000, C257S784000, C257S723000, C257S738000, C257S778000, C257S202000, C257S204000, C257S208000, C257S210000, C257S280000, C257S724000, C257S528000, C257S532000, C257S781000, C257S779000, C257S786000
Reexamination Certificate
active
07468551
ABSTRACT:
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.
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Co-pending U.S. Patent App. MSLin-98-004C, U.S. Appl. No. 10/420,596, filed Apr. 22, 2003, assigned to the same assignee, “High Performance Sub-System Design and Assembly”.
Co-pending U.S. Patent App. MSLin-98.005 CIP, U.S. Appl. No. 11/181,175, filed Jul. 14, 2005, assigned to the same assignee, “A Multiple Selectable Function Integrated Circuit Module”.
Co-pending U.S. Patent App. MSLin-99-001, U.S. Appl. No. 10/385,953, filed Mar. 11, 2003, Assigned to the same assignee, A Software Programmable Multiple Function Integrated Circuit Module.
Takahashi, et al., “3-Dimensional Memory Module”, Semi, pp. 166-167, (1997).
Lin Mou-Shiung
Peng Bryan
Ackerman Stephen B.
Megica Corporation
Pike Rosemary L. S.
Saile Ackerman LLC
Williams Alexander O
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