Multiple die stack apparatus employing T-shaped interposer...

Details Multiple die stack apparatus employing T-shaped interposer... Multiple die stack apparatus employing T-shaped interposer...

2007-10-16

2007-10-16

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25031, C257SE25011, C257S777000, C257S784000, C257S786000, C257S685000, C257S732000, C257S723000

Reexamination Certificate

active

11302005

ABSTRACT:
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed.

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