HSQ dielectric interlayer
Hybrid metal fully silicided (FUSI) gate
Hybrids semiconductor circuit
Hydrogenated oxidized silicon carbon material
IC chip
IC on non-semiconductor substrate
IC on non-semiconductor substrate
III-V semiconductor gate structure and method of manufacture
Implementation of a metal barrier in an integrated...
Increasing the susceptability of an integrated circuit to...
Insulating film for use in semiconductor device
Insulating layer having decreased dielectric constant and...
Insulating layer having decreased dielectric constant and...
Insulating layer having graded densification
Integrated circuit and seed layers
Integrated circuit device having cyanate ester buffer coat
Integrated circuit device having cyanate ester buffer coat...
Integrated circuit having a semiconductor arrangement
Integrated circuit having reduced soft errors and reduced penetr
Integrated circuit having reduced soft errors and reduced...