Integrated circuit having a semiconductor arrangement

Details Integrated circuit having a semiconductor arrangement Integrated circuit having a semiconductor arrangement

2007-02-28

2010-11-16

Vu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S760000, C257S337000

Reexamination Certificate

active

07834427

ABSTRACT:
An integrated circuit including a semiconductor arrangement, a power semiconductor component and an associated production method is disclosed. One embodiment includes a carrier substrate, a first interconnect layer, formed on the carrier substrate and has at least one cutout, an insulating filling layer, formed on the first interconnect layer and the carrier substrate and fills at least one cutout, an SiON layer, formed on the filling layer, and a second interconnect layer, formed over the SiON layer.

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An Office Action for German Patent Application No. 10 2007 032 387.7-33 dated Feb. 2, 2009 (3 pages).

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