Integrated circuit device having cyanate ester buffer coat

Details Integrated circuit device having cyanate ester buffer coat Integrated circuit device having cyanate ester buffer coat

1996-02-20

1999-05-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

257702, 257701, 257787, 257788, H01L23/28

Patent

active

059030461

ABSTRACT:
An integrated circuit including a fabricated die having a cyanate ester buffer coating material thereon. The cyanate ester buffer coating material includes one or more openings for access to the die. A package device may be connected to the die bond pads through such openings. Further, an integrated circuit device is provided that includes a fabricated wafer including a plurality of integrated circuits fabricated thereon. The fabricated wafer has an upper surface with a cyanate ester buffer coating material cured on the upper surface of the fabricated integrated circuit device. Further, a method of producing an integrated circuit device includes providing a fabricated wafer including a plurality of integrated circuits and applying a cyanate ester coating material on a surface of the fabricated wafer. The application of cyanate ester coating material may include spinning the cyanate ester coating material on the surface of the fabricated wafer to form a buffer coat.

REFERENCES:
patent: 3755402 (1973-08-01), Grigat et al.
patent: 3994949 (1976-11-01), Meyer et al.
patent: 4022755 (1977-05-01), Tanigaichi et al.
patent: 4056681 (1977-11-01), Cook, Jr.
patent: 4330658 (1982-05-01), Ikeguchi et al.
patent: 4740584 (1988-04-01), Shimp
patent: 4820855 (1989-04-01), Gaku et al.
patent: 5026667 (1991-06-01), Roberts, Jr.
patent: 5034801 (1991-07-01), Fischer
patent: 5102718 (1992-04-01), Tingerthal et al.
patent: 5132778 (1992-07-01), Juskey et al.
patent: 5137846 (1992-08-01), Machuga et al.
patent: 5194930 (1993-03-01), Papathomas et al.
patent: 5198695 (1993-03-01), Hanes et al.
patent: 5268193 (1993-12-01), Beuhler et al.
patent: 5300735 (1994-04-01), Yokono et al.
patent: 5388328 (1995-02-01), Yokono et al.
patent: 5438022 (1995-08-01), Allman et al.
patent: 5504374 (1996-04-01), Oliver et al.
patent: 5530288 (1996-06-01), Stone
patent: 5563380 (1996-10-01), Rostoker et al.
patent: 5569493 (1996-10-01), Granger et al.
patent: 5571740 (1996-11-01), Peterson
patent: 5579573 (1996-12-01), Baker et al.
patent: 5604978 (1997-02-01), Sherif et al.
patent: 5605781 (1997-02-01), Gelorme et al.
patent: 5656862 (1997-08-01), Papathomas et al.
patent: 5660920 (1997-08-01), Buckley et al.
patent: 5667884 (1997-09-01), Bolger
Shimp et al., Arocy.COPYRGT. Cyanate Ester Resins Chemistry, Properties and Applications, Second Edition, 1-36 (1990).

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