Implementation of a metal barrier in an integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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C257S775000, C257S776000

Reexamination Certificate

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08053871

ABSTRACT:
A metal barrier is realized on top of a metal portion of a semiconductor product, by forming a metal layer on the surface of the metal portion, with this metal layer comprising a cobalt-based metal material. Then, after an optional deoxidation step, a silicidation step and a nitridation step of the cobalt-based metal material of the metal layer are performed. The antidiffusion properties of copper atoms (for example) and the antioxidation properties of the metal barrier are improved.

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Preliminary French Search Report and Written Opinion, FR 06 09038, dated May 10, 2007.
Noda, et al., “Selective Silicidation of Co Using Silane or Disilane for Anti-Oxidation Barrier Layer in Cu Metallization,” Japanese Journal of Applied Physics, vol. 43, No. 9A, Sep. 2004, pp. 6001-6007; XP002432923.

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