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Compression layer on the lead frame to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Compression layer on the leadframe to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Compression layer on the leadframe to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Compression layer on the leadframe to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Computer system including at least one stress balanced...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Concealable chip leadframe unit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Condition sensitive adhesive tape for singulated die...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Conductor frame and housing for a radiation-emitting...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Conductor frame for an electronic component and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Conductor reticulation for improved device planarity

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Conductor substrate, semiconductor device and production...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Conformal shield on punch QFN semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Connecting a die in an integrated circuit module

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Connecting lead for semiconductor devices and method for fabrica

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Connection component with releasable leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Connection components with frangible leads and bus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Connection components with frangible leads and bus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Contact agency interposed between IC and IC receptacle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Contact spring application to semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Controlled impedance leads in a leadframe for high frequency...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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