Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1999-03-01
2000-05-09
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257693, 257775, 257737, 257787, H01L 2348, H01L 2352, H01L 2940
Patent
active
060607718
ABSTRACT:
A highly reliable connecting lead for devices that mount semiconductors. The lead is made of copper or copper alloy. The thickness of the oxide film at the interface between the copper or copper alloy lead and an aluminum bump electrode is 10 nm or less. The contents of oxygen and carbon in the aluminum bump electrode are 1 atm % or less each.
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Hashimoto Shogo
Tomikawa Tadashi
Clark Jhihan B.
Saadat Mahshid
Sumitomo Electric Industries Inc.
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