Connection component with releasable leads

Details Connection component with releasable leads Connection component with releasable leads

1995-10-24

1998-06-09

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257642, 257643, 257674, 257690, 257773, 174260, 361767, H01L 2336, H01L 2348

Patent

active

057639418

ABSTRACT:
A connection component for a microelectronic device such as a semiconductor chip incorporates a dielectric layer and leads extending across a surface of the dielectric layer. Each lead has one end permanently fastened to the dielectric layer and another end releasably bonded to the dielectric layer. The releasable end is held in place by a bond having a relatively low peel strength, desirably less than about 0.35.times.10.sup.6 dynes/cm.

REFERENCES:
patent: 3825353 (1974-07-01), Loro
patent: 4451505 (1984-05-01), Jans
patent: 4651191 (1987-03-01), Ooue et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5065223 (1991-11-01), Matsuki et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5196268 (1993-03-01), Fritz
patent: 5376326 (1994-12-01), Medney et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5548091 (1996-08-01), DiStefano et al.

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