Conductor substrate, semiconductor device and production...

Details Conductor substrate, semiconductor device and production... Conductor substrate, semiconductor device and production...

2007-11-27

2007-11-27

Purvis, Sue A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23056

Reexamination Certificate

active

10824523

ABSTRACT:
A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and the conductor substrate is partly or entirely covered with a layer of copper oxide containing a hydroxide formed upon the surface treatment of the conductor substrate and a process of producing the conductor substrate as well as a process for the production of a semiconductor device using the conductor substrate.

REFERENCES:
patent: 4518449 (1985-05-01), Kamada
patent: 4888449 (1989-12-01), Crane et al.
patent: 4997722 (1991-03-01), Adler
patent: 5459103 (1995-10-01), Kelleher et al.
patent: 5785791 (1998-07-01), Letterman, Jr. et al.
patent: 5861076 (1999-01-01), Adlam et al.
patent: 6034422 (2000-03-01), Horita et al.
patent: 2002/0152596 (2002-10-01), Tsubosaki et al.
patent: 2003/0044597 (2003-03-01), Nagai et al.
patent: 2003/0227073 (2003-12-01), Yurino
patent: 60-201651 (1985-12-01), None
patent: 3-295262 (1991-12-01), None
patent: 9-148509 (1997-06-01), None
patent: 2001-210776 (2001-08-01), None
patent: 2002-231871 (2002-08-01), None

Affiliated with

Also associated with

Rating

Conductor substrate, semiconductor device and production... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductor substrate, semiconductor device and production..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductor substrate, semiconductor device and production... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3827797