Conductor frame for an electronic component and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Reexamination Certificate

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Details

C257S666000, C257S673000, C257S676000, C257SE33066, C257SE23031

Reexamination Certificate

active

07550827

ABSTRACT:
Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

REFERENCES:
patent: RE37707 (2002-05-01), Bozzini et al.
patent: 69113079 (1996-05-01), None
patent: 0496078 (1992-07-01), None
patent: 61279161 (1986-12-01), None
patent: 01175250 (1989-07-01), None
Authorized officer: Kuchenbecker, J., International Search Report, PCT/DE2005/001402, Feb. 9, 2006.

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