Compression layer on the leadframe to reduce stress defects

Details Compression layer on the leadframe to reduce stress defects Compression layer on the leadframe to reduce stress defects

1999-04-23

2000-10-31

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257673, 257676, 257666, 257700, 257674, 257783, H01L 2348, H01L 2328, H01L 2944

Patent

active

061406953

ABSTRACT:
An LOC die assembly includes a die dielectrically adhered to the underside of a lead frame. The active surface of the die underlying the attached lead frame is coated with a polymeric material such as polyimide. The underside of the lead frame overlying the die is coated with a layer of soft material, such as silver, which has a lower hardness than the coating on the active surface for absorbing point stresses. Penetration of stacked filler particles into the soft material reduces point stresses on the active die surface and disadhesion stresses on the lead frame components.

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