LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat transfer configuration for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Heat transfer material for an improved die edge contacting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat transfer module for ultra high density and silicon on silic

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat transfer of solid-state devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat transfer structure for a semiconductor device utilizing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat transfer structure for a semiconductor device utilizing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Heat-conductive composite material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat-dissipating assembly for removing heat from a flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat-dissipating device of a semiconductor device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat-dissipating package for microcircuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat-dissipating semiconductor package structure and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat-dissipating structure and heat-dissipating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat-dissipative coating

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat-radiating device of chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat-releasing printed circuit board and semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat-spread substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heatpipesink having integrated heat pipe and heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heatplates for heatsink attachment for semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Heatsink and package structure for wirebond chip rework and repl