Heatplates for heatsink attachment for semiconductor chips

Details Heatplates for heatsink attachment for semiconductor chips Heatplates for heatsink attachment for semiconductor chips

2009-02-26

2010-11-16

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S675000, C257S704000, C257S718000, C257S719000, C257S722000, C257S726000, C257S727000, C257SE23051, C257SE23086, C257SE23101, C257SE23102, C361S689000, C361S709000, C361S712000, C174S545000, C174S548000, C174S561000, C174S562000, 43

Reexamination Certificate

active

07834444

ABSTRACT:
An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.

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