Heat-dissipating semiconductor package structure and method...

Details Heat-dissipating semiconductor package structure and method... Heat-dissipating semiconductor package structure and method...

2011-08-30

2011-08-30

Chen, Jack (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S720000, C257SE21502

Reexamination Certificate

active

08008769

ABSTRACT:
A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

REFERENCES:
patent: 6369455 (2002-04-01), Ho et al.
patent: 6798054 (2004-09-01), Lo et al.

Affiliated with

Also associated with

Rating

Heat-dissipating semiconductor package structure and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-dissipating semiconductor package structure and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-dissipating semiconductor package structure and method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2770189