Heat-releasing printed circuit board and semiconductor chip...

Details Heat-releasing printed circuit board and semiconductor chip... Heat-releasing printed circuit board and semiconductor chip...

2008-01-28

2010-02-16

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S698000, C977S742000

Reexamination Certificate

active

07663226

ABSTRACT:
A heat-releasing printed circuit board and semiconductor chip package are disclosed. The heat-releasing printed circuit board includes an insulation layer, on a surface of which a circuit pattern is formed, and a solder resist, which is stacked on the insulation layer, where the solder resist contains carbon nanotubes. The heat-releasing printed circuit board allows the heat generated in a semiconductor chip to be dispersed in several directions of the board or package, to improve heat-releasing property.

REFERENCES:
patent: 6897009 (2005-05-01), Johnson et al.
patent: 6946410 (2005-09-01), French et al.
patent: 7253431 (2007-08-01), Afzali-Ardakani et al.
patent: 2004/0238887 (2004-12-01), Nihey
patent: 2006/0105523 (2006-05-01), Afzali-Ardakani et al.
patent: 2002-9213 (2002-01-01), None
patent: 10-2007-0065789 (2007-06-01), None
Korean Office Action issued on Jan. 28, 2009 in corresponding Korean Patent Application 10-2007-0098381.

Affiliated with

Also associated with

Rating

Heat-releasing printed circuit board and semiconductor chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-releasing printed circuit board and semiconductor chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-releasing printed circuit board and semiconductor chip... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4215357