3D interconnect with protruding contacts

Details 3D interconnect with protruding contacts 3D interconnect with protruding contacts

2007-08-28

2007-08-28

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S692000

Reexamination Certificate

active

10960827

ABSTRACT:
This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.

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