3-D packaging using massive fillo-leaf technology

Details 3-D packaging using massive fillo-leaf technology 3-D packaging using massive fillo-leaf technology

1996-04-03

1998-07-28

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257685, 257723, 257724, H01L 2302

Patent

active

057866295

ABSTRACT:
This invention relates to a three-dimensional package or module which includes a large number of subassemblies or fillo-leafs arranged in a stack. The subassemblies which carry integrated circuits are bonded at one of their edges so they extend cantilever fashion into a fluid coolant. Each fillo-leaf includes a heat dissipating element and one is spaced from another by an ultraviolet light cured material which is in registry with a transparent edge portion of each fillo-leaf. The transparent edge portions are formed, on the wafer level, and used, on the wafer level to cure the U.V. curable material.
Pairs of encoder lines which are used to provide a unique address extend from the edge of each fillo-leaf to an associated comparator. When stacks of fillo-leafs are diced from a stack of wafers, the pairs of encoder lines are encoded by shorting or not shorting the exposed ends of encoder lines which extend from the edge of each fillo-leaf.

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patent: 5473198 (1995-12-01), Hagiya et al.
patent: 5502333 (1996-03-01), Bertin et al.
patent: 5652462 (1997-07-01), Matsunaga et al.

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