3-D stackable semiconductor package

Details 3-D stackable semiconductor package 3-D stackable semiconductor package

2006-10-10

2006-10-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S685000, C257SE25013, C257SE25021

Reexamination Certificate

active

07119429

ABSTRACT:
A 3-D stackable semiconductor package includes a first component and a second component. The semiconductor package is formed by stacking the back of the first component and the back of the second component together. The metal pads on the surfaces of the first component and the second component are redistributed to the edge of the first and the second components by a redistribution layer. A plurality of electric conduction posts is formed at the edge of the first and the second component to transmit electric signals between them. The semiconductor package transmits electric signals to the PCB by the electric conductive bumps.

REFERENCES:
patent: 5602420 (1997-02-01), Ogata et al.
patent: 5818107 (1998-10-01), Pierson et al.
patent: 6359340 (2002-03-01), Lin et al.
patent: 6611052 (2003-08-01), Poo et al.
patent: 2005/0098869 (2005-05-01), Shiozawa

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