Multichip module with heat sink and attachment means
Multichip press-contact type semiconductor device
Multilayer interconnect board and multilayer semiconductor...
Multilayer interconnection board, semiconductor device...
Multiple power density chip structure
Nanotube based vapor chamber for die level cooling
Nanotube materials for thermal management of electronic...
Narrow channel finned heat sinking for cooling high power electr
Noise eliminating element and electrical circuit having the same
Non-mechanical magnetic pump for liquid cooling
Non-rectangular thermo module wafer cooling device using the...
On-chip cooling systems for integrated circuits
On-chip temperature gradient minimization using carbon...
Optical semiconductor device package and optical...
Optimization of electronic package geometry for thermal...
Package and method for attaching an integrated heat spreader
Package and package assembly of power device
Package for a semiconductor device
Package for EMI, ESD, thermal, and mechanical shock protection o
Package for semiconductor elements having thermal dissipation me