Package and package assembly of power device

Details Package and package assembly of power device Package and package assembly of power device

2007-02-28

2010-12-07

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S730000, C257S739000, C257S796000, C257SE23123, C257SE23124, C257SE23080, C257SE23083, C438S051000, C438S112000, C438S122000, C438S124000, C438S126000, C438S127000

Reexamination Certificate

active

07847395

ABSTRACT:
A package and a package assembly for a power device having a high operation voltage and impulse voltage are provided. The package assembly for a power device comprises an assembly wherein the power device is encapsulated and electrically connected to a lead protruding outside the package, and an isolation spacer filling a clearance distance between the package and a heat sink attached to the package.

REFERENCES:
patent: 5760425 (1998-06-01), Kobayashi et al.
patent: 2004/0196634 (2004-10-01), Mallik et al.
patent: 2006/0081978 (2006-04-01), Huang et al.
patent: 2006/0202323 (2006-09-01), Shinohara

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