Package for a semiconductor device

Details Package for a semiconductor device Package for a semiconductor device

1998-03-30

1999-03-30

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257675, H01L 23495

Patent

active

058893245

ABSTRACT:
A package for a semiconductor substrate capable of being fabricated with a desirable heat radiation capability. The package includes a laminate metal substrate consisting of a metal plate, an insulator provided on the metal plate, and copper foil provided on the insulator. The metal plate is patterned to form heat spreaders/ground planes and a plurality of solitary land patterns electrically insulated from each other. The copper foil forms wings and an island pattern. The wirings and island pattern are respectively electrically connected to the land patterns and heat spreaders/ground planes by via holes and heat radiation via holes. When the island pattern is provided with ground potential, the heat spreaders/ground planes are also provided with ground potential. At the same time, the heat spreaders/ground planes efficiently release heat output from the rear of an LSI (Large Scaled Integrated Circuit) to the outside of the package.

REFERENCES:
patent: 4835598 (1989-05-01), Higuchi et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5641987 (1997-06-01), Lee
patent: 5708567 (1998-01-01), Shim et al.

Affiliated with

Also associated with

Rating

Package for a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1217242