Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-05-15
2007-05-15
Graybill, David E. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S737000, C257S738000, C257S713000, C257S729000, C257S777000
Reexamination Certificate
active
09678609
ABSTRACT:
In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.
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Graybill David E.
NEC Electronics Corporation
Young & Thompson
LandOfFree
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