Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-10-10
2010-02-09
Fahmy, Wael (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257S522000, C257SE23099, C438S214000
Reexamination Certificate
active
07659616
ABSTRACT:
Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.
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Kumar Kaushik A.
Munoz Andres Fernando
Sievers Michael Ray
Wise Richard Stephen
Capella Steven
Fahmy Wael
International Business Machines - Corporation
Salerno Sarah K
Schmeiser Olsen & Watts
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