Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-12-04
2007-12-04
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257S257000, C257SE23083, C257SE23084
Reexamination Certificate
active
11461803
ABSTRACT:
In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.
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In: The American Heritage Dictionary of the English Language, Fourth Edition,Definition of Word “rivet”, print out from dictionary.com,(2000).
Houle Sabina J.
Reiter Mike T.
Rumer Christopher L.
Skeete Oswald L.
Wienrich Jeff R.
Intel Corporation
Schwegman Lundberg & Woessner, P.A.
Zarneke David A.
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