On-chip temperature gradient minimization using carbon...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S706000, C257S720000

Reexamination Certificate

active

08063483

ABSTRACT:
An electronic device comprises a die with at least one defined hot-spot area; and at least one defined intermediate temperature area at a temperature lower than the temperature of the hot-spot area. The device also comprises a cooling structure comprising at least one bundle of first nanotubes for cooling the hot spot area and at least one bundle of additional nanotubes for cooling the intermediate temperature area, and having heat conductivity lower than the bundle of first nanotubes. The heat conductivity of both sets of the nanotubes is sufficient to decrease any temperature gradient between the defined hot spot area, the defined intermediate temperature area, and at least one lower temperature area on the die. The walls of the first nanotubes and the additional nanotubes are surrounded by a heat conducting matrix material operatively associated with the lower temperature area.

REFERENCES:
patent: 5424054 (1995-06-01), Bethune et al.
patent: 5897945 (1999-04-01), Lieber et al.
patent: 6346189 (2002-02-01), Dai et al.
patent: RE38223 (2003-08-01), Keesmann et al.
patent: 6856016 (2005-02-01), Searls et al.
patent: 6864571 (2005-03-01), Arik et al.
patent: 6887453 (2005-05-01), Brorson et al.
patent: 6909607 (2005-06-01), Radosevich et al.
patent: 6923946 (2005-08-01), Geohegan et al.
patent: 6936182 (2005-08-01), Rushford
patent: 6936565 (2005-08-01), Ma et al.
patent: 6949931 (2005-09-01), Cole et al.
patent: 6951001 (2005-09-01), Chen
patent: 6955937 (2005-10-01), Burke et al.
patent: 6979244 (2005-12-01), Den et al.
patent: 7842554 (2010-11-01), Dimitrakopoulos
patent: 7911052 (2011-03-01), Vadakkanmaruveedu et al.
patent: 2004/0150100 (2004-08-01), Dubin et al.
Mescia, N.C. et al. “Plant Automation in a Structured Distributed System Environment”,IBM J. Res. Develop., vol. 26, No. 4, Jul. 1982.
Carre, H. et al. “Semiconductor Manufacturing Technology at IBM”,IBM J. Res. Develop. vol. 26, No. 5, Sep. 1982.
Gao, et al.,J. Phys. Chem. B2000, 104, 1227-1234.
Fan, S. S. et al., “Self Oriented Regular Arrays of Carbon Nanotubes and Their Field Emission Properties,”Science, vol. 283, pp. 512-514, (1999).
Chandra, Rajit “Automotive electronics need thermal-aware IC design”Automotive Design Line, (Jun. 13, 2005); http://www.automotivedesignline.com/GLOBAL/electronics/designline/shared/article/showArticle.jhtml?articled=164302553&pgno=1.
Hamann, H.F. et al. “Power Distribution Measurements of the Dual Core PowerPC™970MP Microprocessor,” ISSCC Dig. Tech Papers, p. 534, Feb. 2006.
Mo, J. et al. “Integrated Nanotube Cooler for Microelectronic Applications,”Proceedings of the IEEE CPMT Conference on Electronics Components Technology(ECTC55), May 30-Jun. 3, 2005, Orlando, USA, pp. 51-54.
Margulis, L et al.,Journal of Microscopy1996, 181, 68-71.
Dimitrakopoulos, et al. U.S. Appl. No. 11/397,033, filed Mar. 29, 2006, Application as filed; Apr. 12, 2006 Information Disclosure Statement with non-patent documents; Oct. 13, 2009 Information Disclosure Statement with non-patent documents; Nov. 18, 2009 Office communication with non-patent documents; and Jan. 22, 2010 Supplemental Information Disclosure Statement with non-patent documents.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

On-chip temperature gradient minimization using carbon... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with On-chip temperature gradient minimization using carbon..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and On-chip temperature gradient minimization using carbon... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4290468

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.