Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-03-20
2007-03-20
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257SE23051, C257SE23111
Reexamination Certificate
active
10711023
ABSTRACT:
A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different cooling requirements and some of the chips are thinned to insure that the chips requiring the lowest thermal resistance has the thinnest layer of a thermal adhesive or metal or solder interface between the chip and thermal spreader.
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Colgan Evan G.
Katopis George A.
Ramaswamy Chandrashekhar
Stoller Herbert I.
C. Li Todd M.
Cioffi James J.
International Business Machines - Corporation
Mandala Jr. Victor A.
Pert Evan
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