Socket and package power/ground bar apparatus that increases...
Socket with low inductance side contacts for a...
Socketable BGA package
Sockets for “springed” semiconductor devices
Solder ball joint
Solder ball landpad design to improve laminate performance
Solder mask on bonding ring
Solid-state image sensing apparatus and package of same
Solid-state imaging device
Spacer for mounting a chip package to a substrate
Splitting and assigning power planes
Spring connector for making electrical contact at...
Stack package and method of fabricating the same
Stack semiconductor package including an interposer chip...
Stackable chip scale semiconductor package with mating contacts
Stackable layer containing ball grid array package
Stackable layer containing ball grid array package
Stackable semiconductor package
Stackable semiconductor package and manufacturing method...
Stackable semiconductor package and method for manufacturing...