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Selected: D

Direct bonding of small parts and module of combined small...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Direct current regulation on integrated circuits under high...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Direct power delivery into an electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Disposable mold runner gate for substrate based electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Donut power mesh scheme for flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Dual or multiple row package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Dual semiconductor die package with reverse lead form

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Dual-sided substrate integrated circuit package including a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Dummy buried contacts and vias for improving contact via...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Duplexer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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