LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Insulating material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Board-on-chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bondable anodized aluminum heatspreader for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bottom heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bump chip scale semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bumped integrated circuits for optical applications

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bumpless assembly package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

C4 package die backside coating

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Cap wafer, semiconductor chip having the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Capillary underflow integral heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Carrier, semiconductor device, and method of their mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Cavity-down multiple-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Cavity-type integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ceramic base and metallic member assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ceramic base power package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ceramic bonding bridge

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ceramic circuit board and power module