Ceramic base power package

Details Ceramic base power package Ceramic base power package

1991-05-16

1993-03-30

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

361389, 361394, 439 67, 439 71, H01L 2302, H01L 2312

Patent

active

051988852

ABSTRACT:
A high power, hermetic, low cost, high reliability package for electrical devices is described. The package includes in the preferred embodiment an aluminum nitride substrate, copper thick film ink screen printed and fired upon the substrate, a Kovar ring brazed to the copper thick film ink, a thermally dissipating device mounted, the device bonded to electrical feed-throughs that pass through the Kovar ring, and a cover bonded to said Kovar ring to form an additional part of the hermetic seal.

REFERENCES:
patent: 3585272 (1971-06-01), Shatz
patent: 3735213 (1973-05-01), Kansky
patent: 3769560 (1973-10-01), Miyake et al.
patent: 4012093 (1977-03-01), Crane
patent: 4227036 (1980-10-01), Fitzgerald
patent: 4374603 (1983-02-01), Fukunaga et al.
patent: 4753005 (1988-06-01), Hasircoglu
patent: 4791075 (1988-12-01), Lin
patent: 4808113 (1989-02-01), Kanesige et al.
patent: 4934946 (1990-06-01), Ordway
patent: 4987478 (1991-01-01), Braun et al.
Stuckert, "Transmission Line Connector" IBM Tech. Dicclosure Bull. vol. 8 No. 4 Sep. 1965 pp. 518-519.

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