Cavity-down multiple-chip package

Details Cavity-down multiple-chip package Cavity-down multiple-chip package

2005-10-20

2008-11-04

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23101

Reexamination Certificate

active

07446409

ABSTRACT:
A cavity-down multiple-chip package mainly includes a heat spreader, a circuit substrate with an opening, a chip, and at least one electronic element; wherein an upper surface of the circuit substrate defines at least one element mounting area; the heat spreader is disposed on said upper surface of the circuit substrate; and the element mounting area is exposed for disposing these electronic elements. A cavity is formed by the opening of the circuit substrate and the heat spreader and is used for accommodating the chip. A plurality of solder balls can be disposed on a lower surface of the circuit substrate.

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patent: 2003/0085462 (2003-05-01), Aquien et al.
patent: 2004/0164404 (2004-08-01), Huang
patent: 577153 (1991-12-01), None

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