Cavity-type integrated circuit package

Details Cavity-type integrated circuit package Cavity-type integrated circuit package

2004-11-10

2010-06-08

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE31117, C257S711000, C257S676000, C257S712000, C257S713000, C257S706000, C257S698000, C257S666000

Reexamination Certificate

active

07732914

ABSTRACT:
A process for fabricating a cavity-type integrated circuit includes supporting a leadframe strip in a mold. The leadframe strip includes a die attach pad and a row of contact pads circumscribing the die attach pad. A package body is molded in the mold such that opposing surfaces of the die attach pad and of the contact pads are exposed. A semiconductor die is mounted to the die attach pad. Various ones of the contact pads are wire bonded to the semiconductor die and a lid is mounted on the package body to thereby enclose the semiconductor die and the wire bonds in a cavity of the integrated circuit package.

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